发明名称 ELECTRONIC CIRCUIT MODULE
摘要 PURPOSE:To avoid arrangement of an inlet port of cooling air at the sliding part of a chassis and to prevent decrease in heat radiating efficiency due to leakage of the cooling air, by bending the air path of the cooling air in cooling fins, which are formed by molding a thin metal plate material at right angles twice in an electronic circuit module. CONSTITUTION:Metal such as aluminum alloy having excellent heat conductivity is molded in a corrugated shape, and a first cooling fin 20 is formed so as to have the outer configuration of a parallelogram shape. An air path is formed in parallel with one side 22 and facing side 23 of said parallelogram. The outer configuration of a second cooling fin 21 has a right triangle shape. An air path is formed in parallel with a long side 26. Therefore, the stream of cooling air 9, which is inputted through an inlet port 27 of an electronic circuit module 1, is bent right angles twice in the electronic circuit module 1. The cooling air feeding port can be provided at a part suitable for the inlet port 27 of the electronic circuit module 1 under a cover 19. Therefore, leakage of the cooling air through a sliding part 16 between the electronic circuit module 1 and a chassis 12 can be prevented.
申请公布号 JPS63292697(A) 申请公布日期 1988.11.29
申请号 JP19870128657 申请日期 1987.05.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISHIGAKI OSAMU
分类号 H05K7/20;H01L23/46;H01L23/467;H01L23/52 主分类号 H05K7/20
代理机构 代理人
主权项
地址