| 摘要 |
<p>PURPOSE:To improve a PCT reliability and a heat-cycle reliability by a method wherein a semiconductor mounting substrate is buried in resin by molding except a semiconductor element mounting part and the parts of a conductor circuit to which a semiconductor element is connected with bonding wires and, after the semiconductor element is mounted on the substrate and connected to the conductor circuit with the bonding wires, a cover is bonded to the resin. CONSTITUTION:A substrate 1 is buried in resin 7 by molding except a semiconductor element mounting part and the parts of a conductor circuit to which bonding wires are bonded. After a semiconductor element 2 is mounted and bonded with wires, the semiconductor package is sealed with a cover 15. The conductor circuit 4 is formed on the surface of the substrate 1 and the substrate 1 is covered with an insulating layer 5 except the semiconductor element mounting part and the parts of the conductor circuit 4 to which the bonding wires are bonded and further buried in the resin 7. As the insulating layer 5 is covered with the resin 7, it is not necessarily required. The cover 15 may be made of any material and have any shape if only it can maintain and seal tightly a hollow part 13 around the semiconductor element and the bonding wires and is bonded to the molded resin 7 with adhesive and seals the hollow part 13 tightly.</p> |
