发明名称 MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To avoid crackings in a sealing resin unit by a method wherein alignment leads are broken by pulling them while they are removed or after they are removed from the sealing resin unit. CONSTITUTION:An assembled unit in which a sealing resin unit 15 is incorporated is held between a clamping die 18 and a clamping die 19. The clamping die 19 is moved relatively to the clamping die 18 fixing the sealing resin unit 15 along the thickness direction of the sealing resin unit 15. With this movement, positioning leads 4 are pulled up and removed from the bottom of a recess 16. After the clamping die 19 is pulled up so as to make the alignment leads 4 have inclinations about 30 degrees against the bottom of the recess 16, the clamping die 19 is moved relatively to the clamping die 18 along a horizontal direction. With this movement, tensile forces are applied to the positioning leads 4 and the small sectional area parts 13 by the piercing holes 12 are broken and the positioning leads 4 are removed. With this constitution, crackings in the sealing resin unit and the damage of the sealing unit accompanying the breakage of the positioning leads 4 can be avoided.
申请公布号 JPS63291446(A) 申请公布日期 1988.11.29
申请号 JP19870127650 申请日期 1987.05.25
申请人 SANKEN ELECTRIC CO LTD 发明人 YOSHIDA SADAO;TAMURA KAZUYUKI
分类号 H01L21/56;H01L23/48;H01L23/50 主分类号 H01L21/56
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