发明名称 MANUFACTURE OF HIGH-DENSITY MULTILAYERED SUBSTRATE
摘要 PURPOSE:To improve the airtightness and the adhesion strength by a method wherein conductor constituents in a conductor paste are decided in such a way that one or more selected from copper and copper oxide are more than 77 wt.% with reference to copper and that remaining constituents are MnO2, Ag2O and one selected from TiO2 and TiH2. CONSTITUTION:Conductor constituents in a conductor paste are decided in such a way that one or more selected from copper and copper oxide are more than 77 wt.% with reference to copper and that remaining constituents are composed of less than 12 wt.% of MnO2, less than 8 wt.% of Ag2O and less than 3 wt.% of one or more selected from TiO2 and TiH2. Copper and copper oxide are heated, reduced and fired to form a conductor; MnO2 is reduced to form Mn2O3, MnO or Mn and enhances the wettability in relation to a ceramic, crystailized glass and copper inside a substrate. Ag2O is reduced to form Ag, forms a liquid phase of a silver solder Cu-Ag alloy locally at a boundary between copper particles and sinters the copper particles densely. Furthermore, TiO2 or TiH2 is diffused from a metallized part into the ceramic and enhances the adhesion strength. By this setup, the airtightness becomes excellent and the adhesion strength is improved.
申请公布号 JPS63289896(A) 申请公布日期 1988.11.28
申请号 JP19870122486 申请日期 1987.05.21
申请人 NGK SPARK PLUG CO LTD 发明人 KONDO KAZUO;MORIKAWA ASAO;IWATA HIROSHI
分类号 H05K3/46;H05K1/09 主分类号 H05K3/46
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