| 摘要 |
<p>PURPOSE:To facilitate the setting of the prescribed resistance value as well as to make it possible to supply the electronic components in an electrically stabilized manner by a method wherein an insulative film is pasted on a metal thin plate, a resistive circuit or a conductive circuit is formed thereon, and a baking operation is conducted. CONSTITUTION:An insulative film 2 is pasted on a metal thin plate 1, a resistive circuit 4 or a conductive circuit 5 is formed on the insulative film 2, and said resistive circuit 4 and conductive circuit 5 are sintered. For example, a hoop-like cold-rolled steel plate 1 and a roll-formed insulative film 2 are rolled and they are pasted together. After the resistive circuit 4 and the conductive circuit 5 have been printed and baked on the hoop-like substrate 3 on which the insulative film 2 is pasted on the cold-rolled steel plate 1 as above-mentioned, a punching work is conducted as shown in the diagram, they are supplied in the assembling process of the variable resistor as a hoop-like resistance substrate 6. This resistance substrate is cut before it is incorporated into the variable resistor, the coupled part 7 is bent, and it is completed as a resistance substrate 8.</p> |
