| 摘要 |
PURPOSE:To improve the uniformity of films by target materials formed on substrates and the exactness of the film thickness thereof by newly mounting another shutter which opens and closes the aperture of a shutter of a sputtering device to said device. CONSTITUTION:Another sectorial shutter 15 is freely rotatably mounted below the shutter 7 of the sputtering device provided with the substrates 6, 6 to be formed with the films via the shutter 7 above 3 pieces of the targets 3a, 3b, 3c. Sputtered particles 11 from 3 pieces of the targets are passed through the aperture 7a of the rotating shutter 7 and the films thereof are successively formed on the substrates 6. The passage of the sputtered particles 11 from the aperture 7a of the shutter 7 to the prescribed targets is permitted by rotation of another sectorial shutter 15 provided below the shutter 7. While the aperture 7a of the shutter 7 exists between the substrates, said aperture is closed by the shutter 15 to prevent detouring of the unnecessary other sputtered particles 11 from the aperture 7a and forming of the sputtered films having the nonuniform and inexact thickness.
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