| 摘要 |
PURPOSE:To test semiconductor substrates before treatment so that only the substrates that should be treated are enabled to be dipped and treated properly, by providing a light projecting section for applying light to the surface of a semiconductor substrate before it is introduced into a treating tank and an optical sensor section replying only to reflected light from the substrate having a specific wavelength. CONSTITUTION:The surface of a semiconductor substrate 2 is irradiated with light from a light projecting section 3 before the substrate 2 is introduced into a treating vessel 1 of a semiconductor substrate treating apparatus. The light is reflected by the surface of the substrate 2 while a part of the light having specific wavelengths is absorbed thereby according to its proper surface conditions. Such surface conditions will be different according to various manufacturing processes that various substrates have undergone. Accordingly, the reflected light exhibits characteristics peculiar to the manufacturing process that the substrate has undergone. The reflected light from the substrate is received by an optical sensor section 4 which senses either the light having characteristics peculiar to the semiconductor substrates which can be treated by the treating tank or the light having characteristics peculiar to substrates which can not be treated. A control section 5 determines whether the substrate is to be dipped and treated in the tank 1, based on an output from the optical sensor section 4, and the substrate is introduced into the tank 1 only when it is determined to be treated by the control section 5. In this manner, only substrates that should be treated can be treated properly. Further, other semiconductor substrates which should not be treated can be prevented from being damaged by erroneously dipping them in the tank. |
