发明名称 MANUFACTURE OF LEAD FRAME
摘要 PURPOSE:To enable an oxide film on a surface of a lead section to be easily removed through acid pickling and flux treatment so that a excellent solder wetting property can be obtained by a method wherein a strip formed of Fe-Ni alloy containing specified amount of Ni is formed into a prescribed shape through an etching method, and thereafter the surface of the said strip is subjected to ion bombardment through plasma. CONSTITUTION:An Fe-Ni alloy strip, which is composed of Ni 38.5-40.8 %, extremely small amount of impurity controlling physical constant, and Fe for the rest, is formed into a prescribed shape through etching, the surface of which is subjected to ion bombardment through plasma. For example, an alloy consisting of the component and its ratio above mentioned which contains the amount of Si less than 0.13 wt.% as an impurity mentioned above is fused and formed finally into a strip 0.15 mm in thickness through rolling and lead frames are formed out of the strip through a etching method. Moreover, the lead frames are subjected to ion bombardment in Ar gas plasma (Ar pressure; 5X10<-4> Torr) excited by a high frequency output power of 200 W for 10 minutes.
申请公布号 JPS63289949(A) 申请公布日期 1988.11.28
申请号 JP19870125158 申请日期 1987.05.22
申请人 HITACHI CABLE LTD 发明人 SANKI SADAHIKO;SATO JUNICHI
分类号 H01L23/50 主分类号 H01L23/50
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