| 摘要 |
PURPOSE:To obtain an economically excellent mounting method wherein bump electrodes and the conductor of a wiring substrate can be surely connected, by making the height of a plurality of bump electrodes in an integrated circuit device uniform, and bonding electrically the bump electrodes with the conductor of the wiring substrate on which conductive adhesive agent is spread. CONSTITUTION:An integrated circuit device 1 is mounted on a base plate 10 of a press, in the manner in which a plurality of bump electrodes 3 on a semiconductor substrate 2 look upward. From upward, a pressing force P is applied via a pressing board 11 having a clean and flat lower surface, so that the bump electrodes 3, in particular, the vicinities of their top surfaces 3a are deformed, and the height differences are reduced. Paste type conductive adhesive agent 6 is put on a template 21, and transferred in the arrow direction Q while the blade 22a of a squeegee 22 and the like are brought into contact with the template 21. Thus the conductive adhesive agent 6 is filled in a hole 21b. After the top surfaces of the bump electrodes 3 are brought into contact with the conductive adhesive agent 6 spread on a conductor 5, the adhesive agent is hardened. Thereby, the gaps between the top surfaces of the bump electrodes 3 and the conductor 5 are controlled in a small tolerance, and the mounting is enabled wherein the irregularity of resistance value of connection is small and the bonding strength is large. |
