| 摘要 |
PURPOSE:To increase the efficiency of heat dissipation, by bonding a heat conducting plate which is made of a material having high thermal conductivity and has a dimension larger than the radiating surface of a semiconductor integrated circuit chip or an LSI package. CONSTITUTION:A semiconductor integrated circuit chip 2 is mounted, in the manner of face-down, on a substrate having input terminals 11 and an internal wiring 12. On the rear of the semiconductor integrated circuit chip 2, as the radiating part, a heat conducting plate 3, which is a size larger than said part, is soldered. The heat conducting plate 3 is made of a material whose thermal conductivity is higher than the semiconductor chip 2. On the plate 3, a fine gap is formed, which is filled with a thermally conductive flexible compound 41. Thereon a cooling plate 4 is installed, with which a liquid cooling plate 5 having a structure through which a cooling liquid flows is connected. Thereby, the efficiency of heat dissipation can be improved. |
