发明名称 PACKAGE FOR ELECTRONIC CIRCUIT COMPONENT
摘要 PURPOSE:To prevent the generation of cracks in a junction part between lead terminals and a circuit substrate, an insulating member, etc., by arranging, outside the insulating member, a part from the middle portion of a lead terminal retained by the insulating member to an external end of the lead terminal, and separating said part from the insulating member. CONSTITUTION:A part 14a, 14b from the middle portion of a lead terminal 14 retained by an insulating member 13 to the external end of a lead terminal 14, is arranged outside the insulating member 13, separated therefrom, and bent in the form of a crank. Therefore, when the bottom part 14d of external end-portion side of the lead terminal 14 is soldered against the conductor pattern 19 of a circuit substrate 18, distortion mainly caused by the difference of thermal expansion coefficient between the insulating member 13 and the circuit substrate 18, can be absorbed by the parts 14b, 14c of the lead terminal 14 which are positioned outside the insulating member 13. Thereby, the generation of cranks in a junction part between the lead terminal and the circuit substrate, the insulating member, etc., can be prevented.
申请公布号 JPS63289848(A) 申请公布日期 1988.11.28
申请号 JP19870123685 申请日期 1987.05.22
申请人 FUJITSU LTD;FUJI DENKA:KK 发明人 KAGAMI YOSHIO;GOUNJI TAKU;TANI ATSUSHI;KISHI SHOICHI;ANDO KENICHI;SHIRATORI TAKESHI;NISHIMURA TADASHI;YAMADERA SHINICHI
分类号 H01L23/04;H01L23/50 主分类号 H01L23/04
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