| 摘要 |
PURPOSE:To obtain a high density printed wiring board of high quality without using a photosensitive dry film, a work film, and the like by using a laser means to form an etching resist film from an oxidizing film on a copper region on the surface of a copper coated laminated plate in an oxidation accelerating solution so that a circuit pattern of this etching resist film is made similar to the required one. CONSTITUTION:When etching processing is performed to form a circuit pattern directly on a surface of a copper coated laminated plate 1 5 used as a printed wiring board, a laser means 12 is used to form an etching resist film from an oxidizing film 8 on a copper region of said copper coated laminated plate in an oxidation accelerating solution 1 so that a pattern of this etching film is made similar to the required one. For example, copper plating 2 is performed on surfaces of an insulated substrate 10 and a copper foil 2. The oxidizing film 8 with a circuit pattern made similar to the required one is formed on the surface provided with the copper plating 2 and on wall surfaces of a through hole 11 in an oxidation accelerating solution L by the use of a pattern picturing device which uses laser directly related with CAD data. The oxidizing film 8 is provided with alkaline etching processing to form the etching resist film, so that the required pattern is formed. |
