| 摘要 |
PURPOSE:To obtain a circuit board which can be grounded desirably and allows high density packaging, by interposing an intermediate conducting film connected with an earth potential between dielectric substrates and forming peripheral conducting films on the external peripheries of the dielectric substrates such that the peripheral conducting films are connected with the intermediate conducting film through a plurality of through-holes. CONSTITUTION:An intermediate conducting film 1 is interposed between dielectric substrates 2 and 3 formed of glass epoxy, Teflon, alumina or the like. Chip components 9, 11 and conducting films 8, 10 for providing transmission lines or the like are arranged on the external surfaces of the dielectric substrates 2 and 3, while peripheral conducting films 4a, 4b, 5a and 5b are also provided thereon. The intermediate and peripheral conducting films are connected to each other through through-holes 6a, 6b, 7a and 7b. When these substrates are packaged in a shielded case, the peripheral conducting films 4a, 4b, 5a and 5b are connected to the shielded case 12 by means of solder 13.
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