| 摘要 |
PURPOSE:To uniformly contact a semiconductor body with an electrode in a structure that both side surfaces of a semiconductor body are pressure contacted through a slidably placed electrode plate by forming a structure that the body is uniformly contacted with the electrode plate. CONSTITUTION:The second electrode plate 14 of the collector surface of a semiconductor body 11 is constructed in a structure to pressure contact an electrode plate slidably placed from both side surfaces of the body 11 without brazing. An emitter electrode is removed from a main side, and the first electrode plate 13 which faces the drive side without emitter electrode lead is formed in a doughnut shape in which a center is opened. Since a base lead electrode wire 15 is led from the center of a copper cooling electrode which is disposed on the upper surface of the first plate 13, a groove is formed insulate from the plate 13 as the emitter electrode. The plate 13 is constructed to be pressure contacted together with the copper cooler through an insulator 20 at the center. |
