| 摘要 |
PURPOSE:To obtain the title composition excellent in adhesion, heat resistance and storage stability, by mixing a specified reaction product with an ethylenically unsaturated compound, a sensitizer, an epoxy resin and a curing agent. CONSTITUTION:A reaction product (A) of an acid number <=20 is obtained by reacting an epoxy resin having at least two terminal epoxy groups with an unsaturated carboxylic acid having 1.0-2mol., per epoxy equivalent, of ethylene bonds (e.g., acrylic acid) at 60-120 deg.C in the presence of a polymerization inhibitor and an esterification catalyst. Component A is mixed with 0.5-60wt.% unsaturated compound (B) having at least two ethylene bonds (e.g., polyethylene glycol diacrylate), 0.1-10.0wt.% sensitizer (C) (e.g., 2-t- butylanthraquinone), 3-50wt.% epoxy resin (D) and 0.1-30.0wt.% epoxy resin curing agent (e.g., ethylenediamine). |
