| 摘要 |
<p>PURPOSE:To reduce and density the surface mounting components by allowing high-temperature fired chip components to be contained in an arbitrary one layer or a plurality of layers of a multilayered substrate fired at low temperatures, thereby allowing free selection of the number of the contained components. CONSTITUTION:Viaholes 120 and conductor layers 110 are formed in green sheet-like insulating layers 101 and a green sheet-like insulating layer 101' having chip capacitors 150 buried in the center thereof, respectively, which are placed one upon another and fired to form a multilayered substrate. The substrate having been fired becomes a functional component after surface mounting components 130 are soldered thereon. The chip capacitors 150 are not affected so much at the time of a low-temperature firing, because completed ones which have already been completely fired are buried. With this, the capacity value an be freely specified, and the coexistence of large and small capacities also can be easily accomplished. Accordingly, the reduction and densification of the surface mounting components are attained.</p> |
