| 摘要 |
PURPOSE:To omit a heating furnace and the like and to simplify the process of manufacturing, when a semiconductor diode is soldered to the head part of a header lead, by spraying a solder, which is attached to the head part. CONSTITUTION:A header surface 3 of a head part 2 of a header lead 2 comprising copper wire, iron wire and the like is flattened. A solder 4 is attached to the header surface in a swelling shape. Thus a semiconductor element such as a semiconductor diode is soldered. At this time, a spraying gun 7 is arranged so as to face the header surface 3 in order to attach the solder 4. A piece of solder wire 6 is supplied here with a flame 9 being blown from a gas burner through a nozzle 8 of the gun 7. The solder 4, which is fused in this way is attached on the header surface 3 in the swelling shape. Thus the soldering becomes simple and the bonding reliability of the diode is improved.
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