| 摘要 |
PURPOSE:To avoid contamination of leads with resin, by using a top force and a bottom force when a package for containing a semiconductor pellet is formed, forming side walls of the resin on the upper and lower parts of the leads, which are held with the forces, fixing the pellet between the walls, covering the lower side with the resin, and covering the upper side with a cap. CONSTITUTION:A bottom force 1, on the upper surface of which recess parts 3 are provided, is prepared. A top force 2, on the lower surface of which recess parts 4 corresponding to the recess parts 3 are provided, is prepared. Ordinary leads (d) are bridged on the recess parts 3 of the bottom force 1. A lead d', to which a semiconduc tor pellet (e) is attached, is mounted between said leads. Then the bottom force 1 and the top force 2 are brought into contact tightly. Resin is injected into the recess parts 3 and 4, and sidewalls are formed. Thereafter, the bottom force 1 and the top force 2 are removed. The pellet (e) is die-bonded on the lead d'. The terminals of the pellet are connected to the leads (d) through bonding wires (f). The lower side including the side walls is covered with the resin. A cap (h) is coupled with the upper side by utilizing step parts (g) provided on the sidewalls. Thus a package (a) is pro vided.
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