发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To obtain the titled composition, containing a novolak type epoxy resin, a specific condensation product, curing accelerator and inorganic filler and having excellent heat, moisture resistance and quick curability. CONSTITUTION:The aimed composition containing (A) a novolak type epoxy resin (e.g. cresol novolak type epoxy resin), (B) a condensation product of 2,4,6- trimethylolphenol expressed by the formula (X is H, methyl or halogen) with phenol, cresol or halogenated phenol, (C) a curing accelerator (e.g. benzylmethylamine) and (D) an inorganic filler (e.g. fused silica powder). Furthermore, the ratio of the component (B) in the total curing agent is preferably >=50wt.%. The component (C) is in an amount of preferably 0.1-5pts.wt. based on 100pts.wt. component (A) and the component (D) is in an amount of preferably 50-80wt.% in the total composition.
申请公布号 JPS63286424(A) 申请公布日期 1988.11.24
申请号 JP19870122756 申请日期 1987.05.20
申请人 HITACHI CHEM CO LTD 发明人 URUNO MICHIO;NAKAHARA TAKESHI;SAITO TAKAYUKI
分类号 H01L23/29;C08G59/00;C08G59/62;C08L63/00;H01L23/31 主分类号 H01L23/29
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