| 摘要 |
PURPOSE:To make it possible to measure the slope or the like of the surface to be measured and to achieve the improvement of the packaging precision and miniaturization of a title device by arranging on a single package a plurality of semiconductor lasers in two or three dimensions, thereby obtaining the surface information of the surface to be measured. CONSTITUTION:A copper block 5 is welded to the upper surface of a stem 3 of a package 1, and each chip of semiconductor lasers 2A-2C is bonded to each side of the block 5 by a two- or three-dimensional arrangement method. Photo diodes 6A-6C are placed on the surface of the stem 3 in correspondence to the lasers 2A-2C, and are connected to lead stems 4 through connecting terminals 7, 8. With this, monitored by the diodes 6A-6C, the beam intensity of the lasers 2A-2C can independently be controlled, and the light source becomes small-sized and can be positioned with a high precision at the packaging time. Further, by the two- or three-dimensional arrangement, the surface information of the surface to be measured is obtained, and the slope or the like thereof can be measured.
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