发明名称 RESIN COMPOSITION FOR SEALING
摘要 PURPOSE:To obtain the titled composition, containing an epoxy resin, novolak type phenolic resin, beta-lauryl N-lauryl-DL-aspartate and a specific amount of an inorganic filler and having excellent moisture resistance without cracking or opening wires. CONSTITUTION:The aimed composition containing (A) an epoxy resin, (B) a novolak type phenolic resin, (C) beta-lauryl N-lauryl-DL-aspartate expressed by the formula and (D) 25-90wt.% inorganic filler (preferably silica or alumina) as essential components. Furthermore, the equivalent ratio (alpha/beta) of epoxy groups (alpha) in the component (A) to phenolic hydroxyl groups (beta) in the component (B) is preferably 0.1-10.
申请公布号 JPS63286422(A) 申请公布日期 1988.11.24
申请号 JP19870120170 申请日期 1987.05.19
申请人 TOSHIBA CHEM CORP 发明人 NAGATA TSUTOMU;SATO TATSUO
分类号 C08G59/52;C08G59/00;C08G59/18;C08G59/62;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/52
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