发明名称 Packaging material for photosensitive materials.
摘要 <p>A packaging material for photosensitive materials composed of a polyethylene resin film which comprises 5 to 30 wt. % of a high density polyethylene resin having a melt index of more than 0.5 g/10 minutes and a density of higher than 0.950 g/cm&lt;3&gt;, more than 50 wt. % of a linear low density polyethylene resin which the number of carbon atoms of alpha -olefin is 6 to 12 and 0.1 to 20 wt. % of a light-shielding material. In the packaging material of the invention, the HDPE resin raises Young's modulus, and prevents the occurrence of tear and pinholes by the sharp edges of packaged materials. The L-LDPE resin improves tear strength, impact puncture strength, heat sealing properties and the like. The packaging material of the invention is strongly resistant to breakage and puncture, even though it is made thin. The packaging material is excellent in tear strength and impact puncture strength, and it is inexpensive.</p>
申请公布号 EP0292007(A2) 申请公布日期 1988.11.23
申请号 EP19880108144 申请日期 1988.05.20
申请人 FUJI PHOTO FILM CO., LTD. 发明人 AKAO, MUTSUO FUJI PHOTO FILM CO., LTD.
分类号 B32B27/32;B65D65/16;C08F10/02;C08F110/02;C08F210/16;C08J5/18;C08L23/00;C08L23/06;C08L23/08;G03C3/00 主分类号 B32B27/32
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