Epoxy fluorocarbon encapsulating method and article produced.

摘要

A process for encapsulating a substrate comprising placing the substrate in a mold, filling the mold with an encapsulating composition comprising about 5 to about 60 percent by weight of a powdered fluorocarbon dispersed in about 95 to about 30 percent by weight of epoxy resin and curing the composition to form a tight chemical resistant bond with the substrate. Preferably, the particle size of the fluorocarbon is 500 microns or less, most preferably 150 microns or less, and especially preferred 10 microns or less.