| 摘要 |
PURPOSE:To make a lot of LSi chips mountable on one sheet of a substrate, by mounting connector terminals on an upper plane of a package and connecting any connector terminals to leads disposed on a lower or side plane of the package. CONSTITUTION:Conductive pins 11-2 piercing a package 11-1 are disposed on lead mounting positions and other positions of a package in which semiconductor chips are housed to be projected in fixed dimensions from both upper and lower planes of the package. Unillustrated semiconductor chips are connected to some pins 11-2. Leads 11-2a connected to a substrate and connector terminals 11-2b connected to cables are disposed on the lower plane of the package 11-1 and on the upper plane of it, respectively. Namely LSi chips 11 with connector terminals are mounted on the whole main surface of the substrate 12. The connector terminals 11-2b for the LSi chips 11, disposed on terminal edges on the insertion side of the terminals, are connected to connectors 13-1 of a back panel 13 by using cables 14 fitted with cable connectors 14-1, 14-2 on both their ends. Any LSi chips 11 on a front side are connected to this unit by using cables 15 fitted with the cable connectors 14-1, so that mounting density can be upgraded.
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