INSPECTING METHOD FOR HERMETICALLY SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To shorten an inspection time, by hermetically sealing a semiconductor chip in a cavity of a package member and confining a leak testing gas to the cavity. CONSTITUTION:A semiconductor chip 2C is housed in a cavity 2B of a package member 2A in a hermetically sealed semiconductor device 2, and a leak testing gas is confined to the cavity 2B. When the leak testing gas in the cavity 2B of the package member 2A leaks outside the cavity 2B, the gas is detected to inspect airtightness of the cavity 2B. Since the leak testing gas is loaded in the cavity 2B during the process of sealing the semiconductor chip 2C in the cavity 2B, a leak testing time can be shortened.