发明名称 HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To upgrade adhesiveness, airtightness, and working efficiency by providing the following parts: a resin injection part which is opened in an L shape ranging from a side of the susceptor to its surface, comb-shaped and recessed/projected parts which are formed on the susceptor side of the resin injection part exposed to the rear of the susceptor, and L-shaped leads which are connected with a circuit on a ceramic substrate. CONSTITUTION:There are provided the following parts: a resin injection part 11 which is opened in an L shape ranging from a side of a susceptor 1 to its surface 15, comb-shaped and recessed/projected parts 17 which are formed on the susceptor 1 side of the resin injection part 11 exposed to the rear of the susceptor 1, and L-shaped leads 2 which are inserted along the resin injection part 11 and connected with a circuit on a ceramic substrate 4. When resin is injected into the resin injection part 11, an adhesion area is enlarged, so that strength against force for the drawing of the leads 2 and up-and-down/right- and-left force can be increased, and penetration of moisture, contaminated gases, and the like can be prevented further. Since junction areas of the recessed/projected parts 17 and the resin 14 can be enlarged, adhesion strength between the resin 14 and the susceptor 1 can be increased.
申请公布号 JPS63284840(A) 申请公布日期 1988.11.22
申请号 JP19870119908 申请日期 1987.05.15
申请人 SANYO ELECTRIC CO LTD 发明人 MORIMURA YUKIO;NOZAKI TSUTOMU;SAKURAI TOSHIO
分类号 H01L23/02;H01L23/50 主分类号 H01L23/02
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