| 摘要 |
<p>PURPOSE:To protect terminal parts for connecting IC chips at the time of impregnation efficiently by a method wherein the terminal parts are covered with photocuring type resin or film and, after multilayered lamination and molding with adhesive sheets for lamination in between, the chip mounting parts and the terminal parts are cut to expose the photocured resin and remove it. CONSTITUTION:Terminal parts for connecting IC chips are covered with photocuring type resin or film and, after multilayered lamination and molding with adhesive sheets for lamination in between, through-hole plating, outer covering and so forth are applied if necessary. Then the predetermined IC chip mounting parts and the terminal parts are cut to expose the photocured resin or film and remove it. Curing resin compound which contains multifunctional estercyanate family as an essential component is employed as the curing resin compound for a multilayered board. With this constitution, contamination of the terminal parts and so forth caused by resin flow can be avoided and the terminal parts can be protected at the time of multilayered lamination and molding.</p> |
