MANUFACTURE OF SQUARE ELECTRONIC COMPONENT

摘要

PURPOSE:To improve a production yield and reduce production man-hours by automatic mounting by a method wherein a 1st metal layer of Ni or Ni alloy is formed on the whole surface of a square element by a nonelectrolytic plating method and a 2nd metal layer of Sn or Sn alloy is formed on the 1st metal layer by an electrolytic plating method or a nonelectrolytic plating method. CONSTITUTION:A 1st metal layer 3 of Ni or Ni alloy is formed by a nonelectrolytic plating method on the whole surface of a square element 2 made of insulating material such as ceramics or resin and one of the surfaces of the thickness direction of the element is polished by a suitable method. Then a 2nd metal layer 4 of Sn or Sn alloy is formed on the 1st metal layer 3 by an electrolytic plating method or a nonelectrolytic plating method. If a square electronic component manufactured like this is employed for a grounding part, as only as much solder as is required by the surface of the component is supplied to the soldered part when the element is dipped into a solder bath, the variation of the solder quantity can be eliminated and the automatic surface mounting can be applied so that the production man-hours can be reduced.