| 摘要 |
PURPOSE:To make a defective component into a nondefective component through ease of correction by providing an opening formed by etching and adjusting the electric characteristic to a rear side of a semiconductor substrate placed beneath an optional part of a microstrip line. CONSTITUTION:The opening part 8 having a prescribed size by etching is formed to the rear side of the semiconductor substrate 1 placed beneath the optional microstrip line 7 in the rear side etching process. In providing the opening part 8 to the rear side of the semiconductor substrate 1 placed beneath the microstrip line 7, the impedance of the microstrip line 7 is changed. Thus, the size of the opening part 8 is adjusted in response to the result of evaluation of the FET evaluation process for monitor to correct the electric characteristic easily. Thus, the component is corrected into a nondefective correction through easy correction and cost-down is attained by the processing above. |
