| 摘要 |
PURPOSE:To prevent peeling from a printed wiring substrate of separate electronic part mounted onto another surface of the substrate during operation by respectively opposing a lead pattern and a holding pattern formed onto the substrate to a lead for surface-fitting mounting and support pattern for the electronic part and joining opposed sections through solder. CONSTITUTION:When electronic parts (semiconductor ICs), the edge faces and undersides of body sections of which respectively have a large number of leads for surface-fitting mounting and support patterns, are mounted to a printed wiring substrate, leads 2 and support patterns 7 respectively formed to the edge faces and underside of the electronic part 1 and lead patterns 4 and holding patterns 6 shaped to the printed wiring substrate 3 so as to oppositely face these leads 2 and support patterns 7 are joined and unified with solder 5. the surface tension of solder 5 reaches specified force where the electronic part 1 is not peeled on a reflow at that time, thus preventing the possibility of the falling of the electronic part during operation.
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