| 摘要 |
A plurality of thermal ink jet printheads are fabricated from two substrates, at least one of which is a (100) silcon wafer. A plurality of sets of heating element arrays are formed on one substrate, together with addressing electrodes for each heating element. A thick film insulative layer is placed over the heating elements and addressing electrodes which is patterned to remove the thick film from over the individual heating elements, placing them each in a recess, and the thermal end portions of the electrodes including the contact pads therefor. A plurality of ink supplying manifold recesses are anisotropically etched in the silicon wafer and a plurality of sets of channel grooves are formed, each set of which communicate with an associated manifold. The silicon wafer and heating element substrates are aligned and bonded together, so that each channel groove contains a heating element. The individual printheads are formed by first removing unwanted silicon above each set of end portions of electrodes by a dicing operation and then dicing the heating element substrate to obtain the individual printheads. The patterned trough in the thick film insulative layer above the electrode end portions provides the spacing between the two substrates to enable removal of the unwanted silicon without the need of etched relief recesses as used in the prior art.
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