| 摘要 |
PURPOSE:To employ an economical Cu foil as an outermost layer of a conductor pattern of a component mounting substrate by reinforcing a position where a wire is directly bonded to a conductor pattern with Ag paste. CONSTITUTION:An insulating layer 1b is formed on a metal board 1a and a wiring conductor pattern 2 for forming a required circuit is formed on the insulating layer 1b. The material of the conductor pattern 2 is a Cu foil. A semiconductor chip 3 is mounted on a component mounting substrate 1 with a heat spreader 5 in between and fixed with solder. One end of a metal fine wire 6 made of Al is bonded to an electrode metal 4 on the upper surface of the semiconductor chip 3 by ultrasonic welding and the other end of the metal fine wire 6 is directly bonded to the conductor pattern 2 of the component mounting substrate 1 at a predetermined position by ultrasonic welding to form a bonding position 7. Then Ag paste 8 is applied so as to surround the bonding position 7. The Ag paste 8 applied to the bonding position 7 serves as the reinforcing material of the bonding position 7. |
