发明名称 PACKAGE FOR SURFACE MOUNTING PART
摘要 PURPOSE:To enable the upgrading of heat-radiating performance in surface mounting parts even if composition is simple, by providing a sealing cap with screw holes on its corresponding positions just above electronic parts and screwing heat-radiating members into these holes to bring these members into contact with the electronic parts. CONSTITUTION:Heat-radiating members 36 are thermally connected with electronic parts 40, which are enclosed by a shielding cap 30 and a printed wiring plate 10, through screw holes 37 formed in the shielding cap 30. The heat- radiating members 36 are made of materials which are good in heat conduction, and accordingly heat generated in the electronic parts 40 is radiated outside through the heat-radiating members 36. Further, if the shielding cap 30 is also made of a material excellent in heat conduction, said heat-radiating action can be made larger. A package 100 for the surface mounting parts can be manufactured without no heat accumulated therein.
申请公布号 JPS63284836(A) 申请公布日期 1988.11.22
申请号 JP19870119596 申请日期 1987.05.15
申请人 IBIDEN CO LTD 发明人 TAKAHASHI SHINJI;HIRABAYASHI KIMITAKA
分类号 H01L23/34;H01L23/02;H01L23/04 主分类号 H01L23/34
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