发明名称 |
Heat-resistant photosensitive resin composition |
摘要 |
The inventive photosensitive resin composition has excellent heat resistance, adhesiveness to substrate surface and photosensitivity and suitable as a material for solder resist or plating resist on printed circuit boards. The resin composition comprises, in addition to a photopolymerization initiator and curing agent for epoxy resins, a resinous ingredient composed of a diallyl phthalate resin, a first esterified resin as a reaction product of a cresol novolac type epoxy resin and 0.2-0.8 mole per mole of epoxy groups of an ethylenically unsaturated carboxylic acid and a second esterified resin as a reaction product of a phenol and/or cresol novolac type epoxy resins and 0.9-1.1 moles per mole of epoxy resins of an ethylenically unsaturated carboxylic acid in a limited proportion.
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申请公布号 |
US4786579(A) |
申请公布日期 |
1988.11.22 |
申请号 |
US19870038124 |
申请日期 |
1987.04.14 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
TAZAWA, KENJI;SAITO, AKIHIKO |
分类号 |
C08G59/18;C08F299/02;C08G59/00;C08G59/08;C08G59/16;C08G59/40;C08L31/08;C08L63/10;G03F7/032;G03F7/038;H05K3/00;H05K3/18;H05K3/28;(IPC1-7):G03C1/68;G03C5/16 |
主分类号 |
C08G59/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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