| 摘要 |
PURPOSE:To attain high density mount by providing a slot on an end face of a photodetector array chip 12 in the main scanning direction and a corner of an adhered face to be arranged and placed on a board so as to eliminate the noneffective area at joints. CONSTITUTION:A round slot (g) is provided along a cutout line before the dicing process of a wafer (d) in the manufacture of a photodetector array chip. Then the wafer is cut out by using a cutter so as to attain dicing from the surface side of the wafer (d) corresponding to the slot (g). Thus, in arranging plural photodetector array chips in a line, the pitch P1 between the final picture element 11a of the a-th photodetector array chip 22a and the first picture element 11a of the (a+1)-th photodetector array chip 22a+1 is made equal to the normal pitch P among picture elements in the photodetector array chips 22a, 22a+1.
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