发明名称 SENSOR STRUCTURE
摘要 PURPOSE:To fix a case on a mounting bracket requiring neither soldering nor welding, by providing a resin molding part between at least a part of the mounting bracket and the opening side of the case. CONSTITUTION:A resin is molded integral between a case opening 12 and a mounting bracket 11 with the mounting bracket 11 mounted on a case 8, and a resin molded part 9b is formed so as not to cover the perimeter of a mounting surface 11c and a bolt hole 11a of the mounting bracket. In this manner, the case 8 is fit pressed into the mounting bracket 11 and, moreover, the resin molded section 9b is molded integral between these parts, thereby making the case 8 and the mounting bracket 11 join together tightly. This process enables the fixing of the mounting bracket 11 on the case 8 without applying soldering, welding or the like.
申请公布号 JPS63285414(A) 申请公布日期 1988.11.22
申请号 JP19870120966 申请日期 1987.05.18
申请人 SUMITOMO ELECTRIC IND LTD;SANKEN AIR PACKS KK 发明人 SAITO HIDETOSHI;KUME MASAHIRO;MORITA SAKAE
分类号 G01P3/488;B60T8/00;G01D5/245;G01D21/00 主分类号 G01P3/488
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