发明名称 POLISHING METHOD AND DEVICE THEREFOR
摘要 PURPOSE:To achieve polishing work efficiently without using a dresser, etc., by supplying the mixing grinding liquid containing the dressing compound by 2-10 wt.% into a polishing working part and carrying out the polishing work, carrying out cooling and dressing. CONSTITUTION:Polishing working is carried out through the cooling of a workpiece W and the dressing for a polishing grindstone 43, supplying the mixed grinding liquid containing the dressing compound compounded by 2-10 wt.% into grinding liquid into the polishing working part between the workpiece W and the polishing grindstone 43. Therefore, the polishing working part is cooled, and at the same time, the adrasive grains of the dressing compound are introduced into the gap for the sliding action, and shift between the contact surfaces, and the surface of the polishing grindstone 43 is dressed properly, and an always new cutting edge is generated, and the deteriorated adrasive grains are broken and removed. Therefore, the need of the dressing action by a dresser in the prior art is avoided, and the superior uniform cutting performance can be continued for a long time, and polishing work can be achieved efficiently.
申请公布号 JPS63283862(A) 申请公布日期 1988.11.21
申请号 JP19870119532 申请日期 1987.05.15
申请人 SHINTOU BUREETAA KK 发明人 ISHIDA TAKAO;KAGAMI KAZUMI;HAGIWARA HIROSHI
分类号 B24B53/013;B24B53/095;B24B55/02;B24B55/03;B24B57/02 主分类号 B24B53/013
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