| 摘要 |
PURPOSE:To improve on bonding efficiency by a method wherein a bonding region is heated spot-wise while an inert gas is blown to the spot and its vicinity. CONSTITUTION:An electrode section 12 of an IC part 5 is positioned under a bonding tool 8a and is heated by a heating means 10. Simultaneously, an inert gas N2 20 is blown out of a blowing nozzle 14 for the prevention the electrode section 12 from oxidation. The temperature of the electrode section 12 is measured by a non-contact temperature 11. A head controller 9 allows a bonding head 8 to come down and presses an end of a conductive wire to the electrode section 12 for bonding. Similarly, the electrode section 12 of a wiring pattern on a substrate 3 is positioned under the bonding tool 8a, heating is accomplished by the heating means 10 in the inert atmosphere, the bonding head 8 is allowed to come down for bonding, and then the conductive wire is disconnected. With the heating means 10 heating only the electrode section 12 to be bonded, solder 7 on an electronic component 6 remains solid and, because of the inert atmosphere, free of oxidation. This enables high-efficiency bonding. |
