| 摘要 |
PURPOSE:To render thermal conduction between fins stable by a method wherein a housing and each fin of a heat transfer element are so set as to form an angle smaller than 30 deg. with a line perpendicular to the reference plane where the heat transfer element is in contact with the rear of a semiconductor chip. CONSTITUTION:A semiconductor chip 3 is mounted on a substrate 1 through a soldering ball 2. Heat generated by the chip 3 is transferred through such a structure in which fins 7 of a heat transfer element are engaged with fins 8 of a housing 5. Fins are so set as to form an angle of theta with a line 12 perpendicular to a face 9 in contact with the rear of the chip 3, and fins 13 are so set as to form the same angle of theta with a line perpendicular to a reference plane 10 of a housing 5 formed in parallel with the face 9. The angle theta is rendered smaller than 30 deg.. By these processes, the heat faces of the fins are in contact with each other without fail by engaging them, therefore a thermal conduction between fins can be rendered stable.
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