| 摘要 |
PURPOSE:To suppress thermal influence affecting except good operability and junction and to efficiently solder by melting the solder from below a substrate to the through hole of the substrate, and inserting leads from the upside of the substrate. CONSTITUTION:With the mounting face of a component 3 disposed upside a printed substrate 1 is conveyed into an apparatus, set to the upper position of a light source unit 6, the unit 6 is so positioned that a second focal point is matched to the through hole 1a of the substrate 1 to become the mounting position of the component 3, and a light beam is irradiated from the lower side of the substrate 1 to the hole 1a. Thus, a spot 9 is irradiated to the region where the holes 1a are aligned to quickly melt a solder 8 filled in the holes 1a. The lead 3a of the component 3 are inserted into the hole 1a from upside of the substrate 1 to solder the substrate 1 to the lead 3.
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