发明名称 RESIN FILLER
摘要 PURPOSE:To obtain a filler useful as a sealing agent for electronic components, an insulating material, a heat-dissipating sheet, etc., and excellent in moldability, burr preventing effect, curing characteristics and thermal shock resistance, having a specific surface in a specified range and a packed bulk density in a specified range. CONSTITUTION:A powder of silica, rock crystal, alumina or the like, a powder of a pyrolyzate of a chloro-titanium compound, a chlorosilane compound or the like, a powder of a hydrolyzate of an alkoxytitanium compound or the like powder is fused with a flame of an inflammable gas, a plasma flame, a radio frequency furnace or the like to obtain a resin filler of a particle diameter >=500mum, comprising a spherical powder of (semi)fused silica, silica/titania glass, etc., having a specific surface area, s, of 0.5-10m<2>/g and a packed bulk density (g/ml) higher than the value determined by the equation: 1.5-0.14s, provided that when this value is below 0.5, the bulk density >=0.5g/ml. 0.002-1pt.wt. this filler is optionally mixed with, for example, 1pt.wt. another filler of an aspect ratio of 1-1.5, and further mixed with a resin so that its content may be 20-97wt.%.
申请公布号 JPS63284237(A) 申请公布日期 1988.11.21
申请号 JP19870118848 申请日期 1987.05.18
申请人 DENKI KAGAKU KOGYO KK 发明人 CHIBA TAKASHI;TAKAHASHI KAZUO;OTAGURO KENJI
分类号 C08K7/16;C08G59/62;H01B3/30 主分类号 C08K7/16
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