| 摘要 |
PURPOSE:To protect wires from peel-off by a method wherein the entire wirings and connections involving wires are covered by an oxidation-corrosion preventing agent after the accomplishment of connection between a semiconductor element and inner leads. CONSTITUTION:A semiconductor element 1 is bonded to an island 2 on a lead frame. Next, connection is established by a wire 3 between an electrode 1a of the semiconductor element 1 and a connecting portion 4a of an inner lead 4, and the wire 3, electrode 1a, and connecting portion 4a are coated by a thin film 11. For the provision of the coating, the potting method, wherein an oxidation-corrosion preventing agent in gel is caused to drip, or the spaying method, wherein the same is converted into spray before application, is used. A packaging process follows wherein resin is used for sealing the wire 3, inner lead 4, and element 1 in a package 12. This method suppresses the degrading of a wire as a whole or of its bonded portions, preventing the wire from peel- off. |
