| 摘要 |
PURPOSE:To prevent a defective soldering with the brushing action of a brush by providing the heat resistant brush on the lower face of a printed circuit board inside the upper part opening of a nozzle. CONSTITUTION:The printed circuit board 18 transferred by a conveyor is immersed to the solder 17 jetted from a nozzle 14 and the numerous surface packaging type chip parts adhered on the lower face of the board 18 are subjected to soldering. In this case, the heat resistant brush 22 arranged slantly is brought into contact with the soldering face of the board 18 under movement, executing a brushing action and coming into even the gap of the crowding places of the chip parts. And the molten solder is forcibly pushed into a very small chip gap with the force of the brush 22 and the chip part subjected to surface packaging in high density is well subjected to soldering. |
