| 摘要 |
PURPOSE:To obtain a pattern accurately by a method wherein a film of a substance whose electric conductivity is lower than that of copper is formed on the surface of a thin copper sheet formed on a substrate material, a resist layer is formed on the film and a copper layer as the conductor pattern is then formed so that a side-etched part at the copper layer can be reduced. CONSTITUTION:Films 18 of a substance whose electric conductivity is lower than that of copper are formed on thin copper sheets 12 formed on a substrate material 10. Patterns of resist layers 20 composed of dry films or resist ink are formed on the films 18. After the films 16 not covered with the resist layers 20 have been removed, protective layers 26 by an electroplating operation are formed on the surface of copper layers 24. The exposed films 18 not covered with the protective layers 26 are removed; the thin copper sheets 12 under the films are treated with an etching solution; conductor patterns are formed on the substrate material 10. By this setup, a side-etched part at the copper layers is reduced, thereby the patterns are formed accurately. |
