| 摘要 |
PURPOSE:To isolate a solder of a solder-repellent phase in a non-plated region by a method wherein, in a face where a conductor part protrudes from a substrate part, the non-plated region is covered with a prescribed dielectric of a silane coupling agent. CONSTITUTION:This assembly is composed of a substrate part 25 and conductor parts formed by a non-electrolytic plating operation; in a face where the conductor parts protrude from the substrate part 25, non-plated regions are covered with a derivative 24 of a silane coupling agent. For this process, the derivative 24 is composed of 3-50 wt.% of rosin, 0.1-15 wt.% of the silane coupling agent, 0.005-0.5 wt.% of a sulfur compound which is added as needed, a plating resist agent for acid plating use and the like. By this setup, a solder of a solder- repellent phase in the non-plated region is isolated. |
