METHOD FOR REGENERATING NI-P PLATED ALUMINUM ALLOY SUBSTRATE

摘要

PURPOSE:To regenerate an Ni-P plated Al alloy substrate with little damage by heating the substrate to a prescribed temp. or above and immersing it in an aq. acid soln. contg. a specified amt. of NO3<-> ions to dissolve and remove the Ni-P plating. CONSTITUTION:An Ni-P plated Al alloy substrate is heated to the crystallization temp. of the Ni-P plating or above to crystallize the Ni-P plating. The heated substrate is immersed in an aq. acid soln. contg. 20-60% No3<-> ions at 30-70 deg.C to chemically dissolve and remove the Ni-P plating. The surface of the substrate is hardly roughened and the substrate can be regenerated to such a degree that is can be plated again.