| 摘要 |
<p>PURPOSE:To eliminate the need of using any bonding member such as eutectic solder or the like and to prevent short circuit between electrodes, by forming plated gold electrodes for an electronic or electric component from a thick plated gold layer, and exerting a pressure as required on the component from the back thereof while heating the same, for thermocompression bonding the component to a circuit pattern. CONSTITUTION:Plated gold electrodes are formed thick enough on the opposite sides of a single-plate ceramic capacitor 1. The capacitor 1 is mounted on a circuit pattern as required on a thin film substrate 2. The substrate 2 is mounted on a hot plate 4 heated to a temperature of 300-320 deg.C so that all of them are heated. A wedge 3 is applied against the upper electrode of the capacitor 1 and a load is exerted to press the capacitor 1 against the substrate 2. According to this method, there is no need of using any bonding member such as eutectic solder or the like and, therefore, the short circuit between the electrodes can be prevented.</p> |
