| 摘要 |
PURPOSE:To enhance the quality by a method wherein a non-conductive and resin-made pin-holding part whose linear expansibility is little is filled between pins and is hardened and formed so that the pins are not allowed to approach and are not arranged irregularly due to deformation, displacement or the like of the pins. CONSTITUTION:A pin-holding part 5 is formed in such a way that a hardening resin material which is heat-resistant, highly pure and non-conductive and whose linear expansibility is little is filled mainly into gaps 3 between individual pins 2 at a prescribed part of a lead frame 1 and is then hardened. By this setup, it is prevented that the pins 2 are allowed to approach and are arranged irregularly due to deformation, displacement or the like of the pins because the lead frame 1 is held by the holding part 5 even when an external force is exerted during a transfer and during a bonding process, a resin molding process or the like. As a result, the quality of the device is enhanced. |
