| 摘要 |
<p>PURPOSE:To enhance the reliability of a semiconductor device by a method wherein a recessed part is formed near a tip part of an inner lead arranged at a periphery of an island part and a metal wire is bonded to the inside of the recessed part in order to prevent the metal wire from hanging downward. CONSTITUTION:Recessed parts 4 are formed near tip parts of inner leads 3, i.e. at parts to which metal wires 11 are connected. Protruding parts 5 which are relatively high due to the recessed parts 4 are formed at the tip parts of the leads 3. The lower surface of the bonded wires 11 is supported by the protruding parts 5 constituted at the tip parts of the leads 3; it is prevented that the wires 11 hang at the protruding parts. As a result, it is prevented that the wires 11 come into contact with a pellet 10 and an island 2. By this setup, the reliability of a semiconductor device is enhanced.</p> |
