发明名称 LIQUID-COOLED MODULE
摘要 PURPOSE:To reduce the number of components while improving the cooling efficiency, by providing heat dissipating fittings such that the reduced-diameter sections thereof extend through the inside of bellows having a flange secured to one end thereof for mounting the bellows on the body. CONSTITUTION:A cooling assembly 13 in which a heat dissipating fitting 13-2 having a reduced diameter section reaching a liquid flow 12b is fixed securely to a bellows 13-1 is secured to each of apertures 12a provided in a body 12 in the positions opposed to LSi's 1-1 packaged on a printed circuit board 1. Each of the LSi's 1-1 on the printed circuit board 1 is pressure-contacted with the contacting surface 13-2a of the fitting 13-2, When cooling liquid is pressure- fed through a pipe 4-1 provided on the body 12, the cooling liquid flows through the liquid path 12b as indicated by the two-dot chain line and cools the leading edges of the reduced-diameter sections of the fittings 13-2. In this manner, the number of components can be reduced while the cooling efficiency can be improved.
申请公布号 JPS63283049(A) 申请公布日期 1988.11.18
申请号 JP19870118331 申请日期 1987.05.14
申请人 FUJITSU LTD 发明人 MOCHIZUKI MASAHIRO;INOUE KATSUMI;SUZUKI MASAKAZU
分类号 H05K7/20;H01L23/46;H01L23/473;H05K7/14 主分类号 H05K7/20
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